MATERIALS

Aluminum Oxide

名稱:氧化鋁
主要用於半導體前段製程(Front-End), 蝕刻(Etch),薄膜(Thin-film),氧化鋁陶瓷在半導體製程中有電氣絕緣、低膨脹、耐高溫、抗強酸鹼腐蝕、耐磨耗、耐電漿等特性

產品運用:
Semiconductor chamber components
TFT.LCD chamber component
High Plasma/chemical resistance require
Precision/structure ceramic component

產品規格

適用於AMAT及LAM的設備或各種客規訂製,歡迎來信洽詢。


DESC AMAT PN 
RING CAPTURE   C ESC SNNF 200MM 0200-00250 
HOUSING GAS   NOZZLE DPS MEC 0200-35291 
COLLAR 200MM   SNNF SML FLT ULTI 0200-18109 
CAPTURE RING   DPS METAL 0200-00247 
DOME,   CERAMIC, DPS CHAMBER, R1 ROUGH KC 0200-10324 
DOME 14"   ID ASTRON TOP ULTIMA 1.5 0200-01006 
DOME CERAMIC,   DPS CHAMBER 0200-39137 


產品詢價

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